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Optimum Automation Performance
The SB300 incorporates a variety of features to provide reliable automation
interface and interoperability:
- Precise full pitch 10 mm wafer spacing provides accurate and reliable
wafer positioning
- Automated FIMS door reduces the labor costs and human error associated
with manual FOSB handling, and minimizes contamination potential from ambient
environments and employee contact
- Equipment interoperability is ensured by a 142 mm square top robotic
lifting flange, lower side conveyor rails and a kinematic coupling plate
Highest Productivity For Your Facility
The SB300 is engineered to improve the overall productivity of your facility
by offering maximum wafer protection, optimum automation interface and increased
overall yield.
- Precise wafer planes maximize your wafer transfer throughput
- Dimensionally stable design maximizes tool and AMHS uptime, allowing less
unscheduled downtime
- FIMS automation minimizes contribution to contamination
- Simple cleaning of entire assembly encourages increased reuse
Materials Description
Ultrapure polycarbonate material is used in the manufacture of the door and
shell assembly, offering:
- Low inorganics
- Low particle generation
- Low outgassing
- Dimensional stability
- SPI recycle code – 7
TPE materials are used in the manufacture of the door strip and gasket,
offering:
- Excellent sturdiness and resilience
- Resistance to creep and flex fatigue
- Low outgassing
- Low levels of metals
- SPI recycle code – 7
The SB300 ergonomic handles are made from black nylon.
The robotic lifting flange is made from carbonfiber-filled polycarbonate.
Product Specifications
- Depth: 13.1" (332.8 mm)
- Width (with handles): 16.4" (415.4 mm)
- Height (including autotop flange):
13.3" (336.9 mm)
- Capacity: 25 wafers
- Pitch: 10 mm
Packaging Specifications
Contact your Entegris representative for details on single unit packaging and
palletized packaging.
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