Spectra FOUP
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Overview The Spectra™ FOUP is a 25+1 capacity front opening
unified pod (FOUP) that provides clean and secure wafer transport, optimum automation integration and low cost of ownership for your facility. |
Features
Industry-proven door for equipment interoperability and long life
Wafer supports integral with shell give excellent wafer plane performance and reliable wafer access
Accurate equipment interfaces
Top robotic flange
Bottom kinematic coupling
Ergonomic side handles for manual handling
Unsurpassed cleanability and dryability
Effective ESD path-to-ground
ESD shell option provides added protection for wafers
Purge capable
High-strength assembly
Wafers retained against shock and vibration
Meets all applicable SEMI standards
Specifications
Overall Size/Weight
Width: 416 mm (16.4")
Depth: 333 mm (13.1")
Height: 335 mm (13.2")
Weight (empty): 4.2 kg (9.26 lb)
(with wafers): 7.3 kg (16.09 lb)
Materials of Construction
Ultrapure polycarbonate used in the FOUP
shell, door housing and door panels
STAT-PROฎ 3000 carbon-filled PEEK
material used in wafer contact areas in
the shell and wafer retainer
STAT-PROฎ 500 carbon-filled polycarbonate
used in the ESD FOUP shell, door housing,
door components
Ultrapure thermoplastic elastomer (TPE)
material used in the critical door seal
Configuration Options and Accessories
Color Options
Color options on shell and door
Five color options available: red, green,
orange, clear and black (ESD shell only)
Configuration Options
Info pads configurable by customer
Identification Options
Cardholders
Color handle inserts
Bar code adhesive labels
RFID molded-in or RFID pill
Ordering Information
These standard part numbers include a rear bracket and RFID pill in bottom horizontal position.
Entegris Literature
Information on these products is also available in PDF format. You will need the Adobe Acrobat Reader from Adobe Systems.
 Spectra Wafer Carrier
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