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A300 G3 FOUP

The A300 G3 FOUP offers advanced wafer isolation technology in a cost-effective design for 300 mm wafer processing.


A300 G3 FOUP

The A300 features:

  • Precision wafer planes
  • Purge options
  • Easy to clean and maintain
  • Long term reliability
  • Superior protection from contaminants
  • Fully SEMI compliant
  • Serialization and traceability
  • Non-metallic door
  • Multiple ESD paths to ground